SUNSHINE SS-T12B INTELLIGENT MAINTENANCE HEATER SS-T12B 1.Supports bonding and separation of Android and IP7G-14PM motherboards, separation of screen frame, etc., fast and accurate layering, tin planting, glue removal, and bonding of motherboards, etc. 2.Modular design，A variety of combined modules, common modules on the base, good scalability, easy to expand new modules. 3.The heating area is large, the compatibility is good, and it supports the desoldering operation of various motherboard components, which is more convenient and quick. 4.Intelligent temperature control, customized temperature adjustment according to different melting points, with fast heating, long life and uniform temperature. 5.360° rotating buckle guide rail design, suitable for precise clamping of motherboards of different shapes, improving maintenance efficiency. 6.The module is equipped with a positioning column, which can be accurately separated and attached to the main board, and is easy to take. 7.Hollow heat dissipation design, high temperature resistance; Silicone wear-resistant foot pads, stable operation, good anti-skid effect. T12B-IP1: Common for most models of screen bracket separation/fingerprint repair/CPU chip degumming/face repair T12B-IP2: Fingerprint repair/A12/A11/X/XS/XSM motherboard delamination T12B-IP3: iPhone 11/11P/11PM/A13 motherboard layering T12B-IP4: CPU chip degumming/12/12Mini/12P/12PM motherboard layering T12B-IP5: iPhone 13/13Mini/13P/13PM/A15 motherboard layering T12B-IP6: iPhone 14/14Plus/14P/14PM/A15/A16 motherboard layering T12B-IP7: iPhone X/XR/XS/XSM/12P/12PM/13/13Mini camera T12B-IP8: iPhone 11/11P/11PM/13P/13PM camera T12B-IP9: iPhone 7G/7P/8G/8P/11/12/12Min/14/14Plus/14P/14PM camera T12B-IP10: Android universal T12B-lP11: iPhone 15/15Plus/15P/15PM/A16/A17 motherboard layering
